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Thin, Fast, and Powerful: MIT’s “Stacked” 3D Chips Shatter Industry Constraints

January 7, 2025 DG Tech Innovations

MIT engineers have developed a method to seamlessly stack electronic layers to create faster, denser, more powerful computer chips. The team deposits semiconducting particles (in

Tag: mit’s

Thin, Fast, and Powerful: MIT’s “Stacked” 3D Chips Shatter Industry Constraints

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